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Tim Cook Has Left 'Big Shoes' To Fill, Says Dan Ives — Gene Munster And Sam Altman React To The Handoff And John Ternus's Rise As Apple CEO
Following the rise of intelligent agents, the entire distribution of the AI value chain has changed! Morgan Stanley: GPUs are no longer everything.
Morgan Stanley's latest report reveals a restructuring in the AI investment landscape: as AI evolves from 'generating content' to 'autonomously executing tasks,' CPU orchestration latency now accounts for 50% to 90% of the total latency in intelligent workflows. This trend is expected to drive the CPU market to a value of $82.5 billion to $110 billion by 2030, with the CPU-to-GPU ratio shifting from '1:12' to '1:2' or even reversing. Additionally, this shift will stimulate new DRAM demand ranging from 15 to 45 EB. The next wave of excess returns will transition from being solely GPU-centric to encompassing enabling segments such as ABF substrates, wafer fabrication, and memory interfaces, which face the slowest capacity expansion and most significant bottlenecks.
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How Hard Is It to Take Over in a Golden Age? Three Major Challenges for Apple's New CEO
Ternus faces three major challenges: First, it continues to lag in the AI field, with Siri’s delays and doubts over the competitiveness of new hardware categories; second, its supply chain is overly reliant on a single region, facing dual pressures from geopolitical tensions and tariffs; third, Cook’s continued tenure raises concerns about potential power friction, making it crucial to ensure sufficient space for his successor.
Accelerated expansion of AI data centers is expected to push the global AI optical module market to $26 billion by 2026.
The global AI optical transceiver module market is expanding rapidly, with its value expected to increase from USD 16.5 billion in 2025 to USD 26 billion in 2026, representing a growth of over 57%. The demand for 800G modules, driven by hyperscale data centers in North America, currently dominates the market, while 1.6T products are accelerating into mass production. However, the tight supply of core chips such as EML lasers remains a key bottleneck for capacity expansion.