Himax Technologies Announced The Unveiling Of The Industry-leading Automotive TDDI (Touch And Display Driver Integration) With High-speed EDP Interface Support, The HX83196/HX83197 Series

Himax Technologies Announced The Unveiling Of The Industry-leading Automotive TDDI (Touch And Display Driver Integration) With High-speed EDP Interface Support, The HX83196/HX83197

Benzinga24minutes ago

Samsung Electronics' U.S. plant to begin trial production of 2nm chips at month-end; orders fully booked, poised to challenge Taiwan Semiconductor

① Samsung Electronics' Taylor fab in Texas is scheduled to begin trial production of 2nm chips by the end of this month, with all current capacity fully booked and an initial monthly output of 50,000 wafers; ② The facility has secured orders from companies such as Tesla and Broadcom, and Samsung expects its 2nm order volume to more than double compared to last year; ③ Construction on Phase II of the Taylor fab is planned to commence by year-end, with mass production targeted for 2030.

cls.cn16:05

Nokia announces the launch of Mobile Core Early Access to help operators accelerate network innovation in the AI era.

Nokia Announces Mobile Core Early Access, a Live Hosted Environment Offering an Up-Close Look at the Software Powering Advanced Network Connectivity in AI

Benzinga15:59

Express News | Haiguang Xinzheng is deepening its global strategic partnership with GlobalFoundries to accelerate the global commercialization of next-generation AI silicon photonic interconnect technology.

On September 7, Haiguang Xinzheng announced a long-term, in-depth strategic cooperation with GlobalFoundries, a global semiconductor manufacturer. The two parties will collaborate on the engineering implementation and mass production of 6.4T NPO products, jointly promoting the industrialization of next-generation AI silicon photonic interconnect technology. Haiguang Xinzheng is a company focused on AI silicon photonic interconnect solutions, with main business activities covering 400G, 800G, and 1.6T optical modules, AOCs, as well as NPO and CPO products. It possesses full-chain technical capabilities ranging from silicon photonic chip design and wafer testing to optical module manufacturing. The company was listed on the Main Board of the Hong Kong Stock Exchange on June 29, 2026, becoming known as the first AI silicon photonic interconnect stock in the Hong Kong market. Shortly after its listing, the company was included as a constituent of the Hang Seng Composite Index on August 21, and subsequently officially entered the lists of eligible stocks for the Shanghai-Hong Kong Stock Connect and Shenzhen-Hong Kong Stock Connect on September 7. In terms of performance, interim data for 2026 showed that the proportion of revenue from Haiguang Xinzheng's silicon photonics business increased from 15.3% to 39.0%, with revenue from 800G products growing from RMB 86.96 million to RMB 239 million, indicating significant volume growth in core products. Regarding product iteration, Haiguang Xinzheng will officially commence shipments of 1.6T optical modules in the second half of the year to supply leading overseas AI computing infrastructure customers, while R&D and customer validation for 3.2T and 6.4T NPO and CPO products are proceeding simultaneously. In terms of order backlog, Haiguang Xinzheng's current order guidance covers the entire year of 2027, and it has secured confirmed orders for tens of millions of DSP chips for 2027, providing supply chain support for the subsequent ramp-up of high-speed product capacity. As a leading global foundational semiconductor manufacturer, GlobalFoundries serves markets including automotive, aerospace and defense, data centers, smart mobile devices, and the Internet of Things, with manufacturing bases in the United States, Europe, and Asia. In the field of AI computing interconnects, GlobalFoundries offers silicon photonic platforms and SCALE co-packaged optics solutions, integrating photonic integration, high-performance RF CMOS, advanced optical components, and fiber connectivity solutions. It collaborates with ecosystem partners across design, packaging, connectivity, and system levels to support the deployment of various optical architectures. Through this collaboration, Haiguang Xinzheng will leverage GlobalFoundries' silicon photonic process technology and scalable global manufacturing network to build a dual-track global manufacturing system operating both domestically and internationally. The two parties plan to achieve end-to-end collaboration from local chip design to scaled delivery for customers in North America and globally. Haiguang Xinzheng stated that this move will not only establish a stable supply foundation for next-generation silicon photonic products but also complete the commercial loop from local R&D to global delivery. Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, noted that Haiguang Xinzheng's comprehensive full-stack silicon photonic design capabilities align highly with GlobalFoundries' advantages in scaled wafer manufacturing, and their cooperation will promote the widespread application of silicon photonic technology in global AI computing infrastructure. In the future, both parties will continue to deepen cooperation in joint R&D of frontier technologies, coordination of global manufacturing capacity, industrialization of NPO and CPO, and co-construction of the industrial ecosystem.

Breakings08:56

Key Takeaways from Brokerage Morning Meetings: AI-Driven Animated Series Accelerate Premiumization, Driving Industry Value Concentration Among Top Players

Huatai Securities believes that the accelerated premiumization of AI-driven animated series is driving industry value to concentrate among top-tier players. China Securities Co., Ltd. expressed optimism about core AI computing infrastructure segments, including chips, optical modules, switches, and PCBs. CICC noted that rising power density and thermal density are elevating liquid cooling and power supply systems from supporting components to core capabilities within entire rack solutions.

cls.cn08:24

Goldman Sachs significantly raises forecast for optical transceiver market: size may reach $148.5 billion by 2028

① High-speed products have become the core growth driver, with the market size for 800G and above optical transceivers expected to increase from $45.2 billion in 2026 to $129.5 billion in 2028; ② The expansion of AI rack-scale systems, increased penetration of ASICs, and higher optical transceiver usage per AI chip are jointly accelerating the ramp-up of demand for 1.6T and 3.2T modules; ③ The penetration rate of silicon photonics in high-speed optical transceivers continues to rise, while Co-Packaged Optics (CPO) remains primarily in the early adoption phase in the short term.

cls.cnSep 7 20:30