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Kangqiang Electronics: First Quarter Report for 2026
Stocks in the memory chip sector collectively rose, with BYWIN Storage up more than 5%, as Samsung plans to raise DRAM prices by 30% in Q2.
Gelonghui, April 7 | The concept stocks of memory chips in the A-share market collectively surged. Among them, Tongyou Technology rose by more than 11%, Shiyin Corporation hit the 10CM limit-up, Shangluo Electronics and Demingli increased by over 7%, Kangqiang Electronics rose by more than 6%, Lianyun Technology and Baiwei Storage climbed by over 5%, while Puyan Corporation, Jiangbo Long, Jintaiyang, Zhengfan Technology, and Youyan Silicon increased by more than 4%. The prices of some DDR5 memory products have slightly declined compared to the previous months. Nevertheless, DRAM manufacturer Samsung is still signing more profitable procurement contracts with bulk buyers. According to ETNews Korea, Samsung Electronics will supply DRAM at a price in the second quarter that is higher than...
Kangqiang Electronics: 2025 Annual Report
Kangqiang Electronics: Summary of the 2025 Annual Report
Kangqiang Electronics (002119.SZ) announced its 2025 annual performance, with a net profit attributable to shareholders of 116 million yuan, representing a year-on-year increase of 40.01%.
Kangqiang Electronics (002119.SZ) released its annual report for 2025. During the reporting period, the company achieved operating revenue of 2.199 billion yuan, representing a year-on-year increase of 11.96%. Net profit attributable to shareholders of the listed company was 116 million yuan, marking a year-on-year increase of 40.01%. Net profit attributable to shareholders of the listed company after deducting non-recurring gains and losses reached 109 million yuan, reflecting a year-on-year surge of 91.60%. Basic earnings per share were 0.31 yuan. The company proposed a cash dividend of 0.4 yuan per 10 shares (including tax) to be distributed to all shareholders.
Express News | Kangqiang Electronics: Plans to invest 1 billion yuan in building a production line for high-density, high-reliability integrated circuit lead frames with an annual output of 150 billion units.