002156 TongFu Microelectronics
- 21.14
- +0.16+0.76%
TongFu Microelectronics News
Tongfu Microelectronics (002156): Good performance in Q1, plans to acquire Jinglong Electronics to deepen the packaging and testing layout
Guide to this report: Due to the recovery in market demand, the company's profits have been significantly recovered from quarter to quarter. With the recovery in market sentiment, the expansion of new customers, and the release of new expanded production capacity, there is plenty of room for future growth. Key investment points: Maintain an increase in holdings rating. 2023 Semiconductor Market
Tongfu Microelectronics (002156): Advanced Packaging Gao Zeng plans to acquire Jinglong Technology to reinforce testing
Incident: Tongfu Microelectronics released its 2023 annual report and 2024 quarterly report. The company achieved operating income of 22.269 billion yuan in 2023, an increase of 3.92% year on year; net profit to mother was 169 million yuan, a year-on-year decrease of 66 million yuan.
Tongfu Microelectronics (002156): Revenue increased 13.8% year-on-year in the first quarter and plans to acquire 26% of Jinglong Technology's shares
Revenue for the first quarter increased 13.8% year over year, with a revenue target of 25.280 billion yuan for 2024. The company achieved revenue of 22.269 billion yuan (YoY +3.92%) in 2023, of which about 95% came from integrated electricity
Tongfu Microelectronics (002156) Company Information Update Report: 2024Q1 Performance Improvement Proposed Acquisition of Jinglong Technology to Enhance Growth Momentum
The company's 2024Q1 performance increased year-on-year, and gross margin continued to improve. Maintaining the “buy” rating, the company released its 2024 quarterly report. The company achieved operating revenue of 5.282 billion yuan in 2024Q1, +13.79% over the same period last year.
Tongfu Microelectronics (002156): Strong profit increase in 24Q1, plans to acquire Jinglong Technology to improve testing business layout
Matters: The company released its 2024 financial report. In the first quarter of 2024, the company achieved operating income of 5.282 billion yuan, an increase of 13.79% over the previous year; net profit to mother was 98 million yuan, an increase of 2064.01% over the previous year. Peace
Express News | Tongfu Microelectronics: Proposed to acquire 26% of Jinglong Technology's shares
Advanced packaging concepts fluctuated higher. Wenyi Technology rose and stopped, while Vogue Optoelectronics, Nike Equipment, Runxin Technology, and Tongfu Microelectronics registered higher gains.
Advanced packaging concepts fluctuated higher. Wenyi Technology rose and stopped, while Vogue Optoelectronics, Nike Equipment, Runxin Technology, and Tongfu Microelectronics registered higher gains.
By Tongfu Microelectronics (002156): 24Q1 profitability shows repair plans to acquire Jinglong to deepen testing business layout
Profitability recovered significantly in 24Q1, and the market gradually recovered. 24Q1 achieved revenue of 5.28 billion yuan, YoY +13.8%, QoQ -17%; realized net profit to mother of 98 million yuan, YoY+206
Express News | Tongfu Microelectronics responds to the reduction of the company's shares by large funds: or will continue to support the company's development based on its own considerations
Tongfu Microelectronics (002156): Waiting for AI terminals to inject new kinetic energy
The 2023 results exceeded our expectations, with revenue of 22.269 billion yuan, +3.92% year over year; gross profit margin of 11.67%, YOY-2.24ppt; net profit to mother of 169 million
Results: Tongfu Microelectronics Co.,Ltd Beat Earnings Expectations And Analysts Now Have New Forecasts
Last week, you might have seen that Tongfu Microelectronics Co.,Ltd (SZSE:002156) released its full-year result to the market. The early response was not positive, with shares down 3.5% to CN¥20.50 in
Huajin Securities released a research report on April 14 stating that it gave Tongfu Microelectronics (002156.SZ) a purchase rating. The main reasons for the rating include: 1) the field of emerging downstream artificial intelligence is booming, and advan
Huajin Securities released a research report on April 14 stating that it gave Tongfu Microelectronics (002156.SZ) a purchase rating. The main reasons for the rating include: 1) the field of emerging downstream artificial intelligence is booming, and advanced packaging has become a powerful tool in the post-Moorish era; 2) the synergy benefits of Tongfu Chaowei Suzhou/Tongfu Chaowei Penang have been highlighted, and market share in various application fields has increased; 3) many advances have been made in the field of advanced packaging technology, and major engineering construction is progressing steadily. (Mainichi Keizai Shimbun)
Tongfu Microelectronics (002156): 23Q4 performance continues to improve, and the company is expected to continue to benefit from advanced packaging trends
Incident: The company released its 2023 annual report. In 2023, it achieved revenue of 22.269 billion yuan, an increase of 3.92% over the previous year; realized net profit attributable to owners of the parent company of 169 million yuan, a year-on-year decrease of 66.24 million yuan
Tongfu Microelectronics (002156): Optimistic that AMD will advance to the high-end in 24 years to drive growth
Tongfu Microelectronics released its 2023 annual report, and Q4 net profit increased 823/ 88% month-on-month. Tongfu Microelectronics released its 2023 annual report. Full-year revenue bucked the trend and increased 3.9% year on year to 22.269 billion yuan, mainly due to 2023
Express News | Tongfu Microelectronics: Net profit in 2023 fell 66.24% year on year, and plans to pay 10 0.12 yuan
Ping An Securities released a research report on April 9 stating that Tongfu Microelectronics (002156.SZ) was given a recommended rating. The main reasons for the rating include: 1) the world's leading semiconductor integrated circuit packaging and testin
Ping An Securities released a research report on April 9 stating that Tongfu Microelectronics (002156.SZ) was given a recommended rating. The main reasons for the rating include: 1) the world's leading semiconductor integrated circuit packaging and testing manufacturer, with seven major production bases around the world; 2) In the AI era, the company will shine with 2.5D/3D advanced packaging technology. (Mainichi Keizai Shimbun)
Tongfu Microelectronics (002156): Taking advantage of AI to deeply bind AMD to become a leader in advanced packaging
Ping An's view: The world's leading semiconductor integrated circuit packaging and testing manufacturer, with seven major production bases in the world: Tongfu Microelectronics is a leading domestic and world-advanced semiconductor integrated circuit package testing service provider, focusing on providing global customers with design
Nvidia's demand for CowOS may triple, and large manufacturers with 2.5d packaging technology are expected to benefit
① According to the supply chain, Nvidia's demand for CoWoS will triple this year compared to last year. ② Yongxing Securities pointed out that orders for TSMC have recently been full, and it is estimated that the shortage of supply will gradually ease until 2024. TSMC's insufficient production capacity may cause major AI chip manufacturers to turn their attention to other OSATs, and major packaging manufacturers with 2.5D packaging technology are expected to benefit from this.
Tongfu Microelectronics (002156.SZ) has mastered ultra-multi-chip FCBGA MCM technology to achieve integration of up to 13 chips and an oversized package of 100 x 100 mm or more
Gelonghui, March 15 | Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that as a national high-tech enterprise, the company has undertaken a number of national technological transformation, scientific and technological research projects, and has achieved fruitful technological innovation results. Among them, the company has mastered FCBGA MCM technology for a large number of chips, integrating up to 13 chips and achieving an oversized package of 100 x 100 mm or more.
Tongfu Microelectronics (002156.SZ): Mainly engaged in integrated circuit packaging testing business
Gelonghui, March 15 | Tongfu Microelectronics (002156.SZ) said on the investor interactive platform that the company is mainly engaged in integrated circuit packaging testing business. Most of the world's top 20 semiconductor companies and the vast majority of well-known domestic integrated circuit design companies have become the company's customers. The company fully supports the diversified development of customers and strives to meet the diverse needs of customers.
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