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Xing Sen Technology (002436.SZ): Guoneng Tongxin has raised a total of 22.9 million yuan in capital
Gelonghui, April 29丨Xing Sen Technology (002436.SZ) announced that the company and Shenzhen Guoneng Jinhui Asset Management Co., Ltd., Li Xuqiang and Cheng Jiangbo jointly signed the “Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership)”. As a limited partner, the company participated in the establishment of the Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership) (hereinafter referred to as “Guoneng Tongxin”), accounting for 47.5983% of the pledged capital. Recently, the company received a notice from the fund manager that Guoneng Tongxin has completed its fundraising and raised sufficient capital
Xing Sen Technology (002436): Industry demand is picking up, semiconductor business is expected to accelerate
The incident describes the recent release of Xing Sen Technology's annual report for 2023 and the report for the first quarter of 2024. In 2023, the company achieved revenue of 5.360 billion yuan, an increase of 0.11% over the previous year; net profit to mother was 211 million yuan, the same as
Bank of China Securities released a research report on April 26 stating that it gave Xingsen Technology (002436.SZ) an increase in holdings rating. The main reasons for the rating include: 1) the company's 23 annual performance was under pressure, and 24Q
Bank of China Securities released a research report on April 26 stating that it gave Xingsen Technology (002436.SZ) an increase in holdings rating. The main reasons for the rating include: 1) the company's 23 annual performance was under pressure, and 24Q1 profit increased sharply year on year; 2) the FCBGA packaging substrate business progressed steadily, forward-looking layout in the high-end PCB field; 3) the production cycle was further shortened, and there were breakthroughs in yield research and development. (Mainichi Keizai Shimbun)
Deep*Company*Xingsen Technology (002436): FCBGA packaging substrates continue to accelerate the upgrading of traditional PCB products
The company released its 2023 annual report and 2024 quarterly report. 23. The annual performance was under pressure, and 24Q1 profit increased sharply year on year. The company vigorously invested in the FCBGA packaging substrate project. Given the company's deep layout at the cutting edge of the industry, it is optimistic
SDIC Securities released a research report on April 25 stating that Xing Sen Technology (002436.SZ) was given a purchase rating, and the target price was 13.54 yuan. The main reasons for the rating include: 1) the industry is under short-term pressure, an
SDIC Securities released a research report on April 25 stating that Xing Sen Technology (002436.SZ) was given a purchase rating, and the target price was 13.54 yuan. The main reasons for the rating include: 1) the industry is under short-term pressure, and the company continues to break through high-end products; 2) FCBGA product strength continues to improve, and yield increases rapidly. (Mainichi Keizai Shimbun)
Minsheng Securities released a research report on April 25 stating that it gave Xingsen Technology (002436.SZ) a recommended rating. The main reasons for the rating include: 1) a smooth transition in revenue in 2023, with high investment in high-end packa
Minsheng Securities released a research report on April 25 stating that it gave Xingsen Technology (002436.SZ) a recommended rating. The main reasons for the rating include: 1) a smooth transition in revenue in 2023, with high investment in high-end packaging boards dragging down short-term performance; 2) focusing on the basic IC packaging business to create the second pole of the company's growth. (Mainichi Keizai Shimbun)
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