The company has been deeply involved in the electronic circuit industry for 30 years. It is a global digital manufacturing provider of advanced electronic circuit solutions. It has mastered core technology and key product mass production capabilities in the field of integrated circuit manufacturing. The product layout covers the field of three-level packaging of electronic hardware, constructs a new digital model of electronic circuit design and manufacturing, and provides customers with high-value overall solutions from design to testing and delivery. Xingsen Technology actively participates in the technological progress of its partners, continues to refine complex processes, and its technical capabilities are in line with international advanced standards, and has won the continuous trust of global benchmark customers in the fields of communications, data centers, industrial control, medical care, and consumer electronics. The company focuses on the advanced electronic circuit solutions industry, which revolves around the two main lines of traditional PCB business and semiconductor business. The PCB business uses a one-stop service business model for CAD design, manufacturing, SMT surface mount and sales. The semiconductor business includes IC package substrates and semiconductor test board businesses. Corporate honors: China's Outstanding Private Technology Enterprise Certificate, Shenzhen Private Key Enterprise Certificate, Shenzhen Nanshan District Science and Technology Incubation Enterprise, China's Top 100 Printed Circuit Industry Enterprise Certificate, etc.
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