Xing Sen Technology (002436.SZ): has not yet entered the leading overseas HBM industry chain
Gelonghui, May 14 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company's FCBGA packaging substrate can be used to package HBM storage, but it has not yet entered the leading overseas HBM industry chain.
Xing Sen Technology (002436.SZ): FCBGA packaging substrates are raw materials for chip packaging and can be used in advanced packaging technologies such as 2.5D and 3D
Gelonghui, May 13丨An investor asked Xing Sen Technology (002436.SZ) on the investor interactive platform, “Advanced chip packaging technology has become mainstream in AI chip packaging. Do advanced packaging technologies such as wafer-level packaging, 2.5D, and 3D have to use FCBGA carriers? Which manufacturers are currently supplying the company's FCBGA carrier boards?” The company replied that the company's FCBGA packaging substrate is a raw material for chip packaging and can be applied to advanced packaging technologies such as 2.5D and 3D, and that chip design companies and packaging manufacturers at home and abroad are the company's target customers.
Xing Sen Technology (002436): The path of Xiongguan is really like iron, but now we are moving from the beginning
The key investment points are based on the PCB model, and the comprehensive layout of high-end fine circuit manufacturing processes. The company is the largest manufacturer of printed circuit boards (PCB) models and small-batch boards in China. It has independently invested in the construction of IC carrier boards, semiconductor test boards, etc.
Xing Sen Technology (002436.SZ): Guoneng Tongxin has raised a total of 22.9 million yuan in capital
Gelonghui, April 29丨Xing Sen Technology (002436.SZ) announced that the company and Shenzhen Guoneng Jinhui Asset Management Co., Ltd., Li Xuqiang and Cheng Jiangbo jointly signed the “Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership)”. As a limited partner, the company participated in the establishment of the Gongqingcheng Guoneng Tongxin Venture Capital Fund Partnership (Limited Partnership) (hereinafter referred to as “Guoneng Tongxin”), accounting for 47.5983% of the pledged capital. Recently, the company received a notice from the fund manager that Guoneng Tongxin has completed its fundraising and raised sufficient capital
Xing Sen Technology (002436): Industry demand is picking up, semiconductor business is expected to accelerate
The incident describes the recent release of Xing Sen Technology's annual report for 2023 and the report for the first quarter of 2024. In 2023, the company achieved revenue of 5.360 billion yuan, an increase of 0.11% over the previous year; net profit to mother was 211 million yuan, the same as
Bank of China Securities released a research report on April 26 stating that it gave Xingsen Technology (002436.SZ) an increase in holdings rating. The main reasons for the rating include: 1) the company's 23 annual performance was under pressure, and 24Q
Bank of China Securities released a research report on April 26 stating that it gave Xingsen Technology (002436.SZ) an increase in holdings rating. The main reasons for the rating include: 1) the company's 23 annual performance was under pressure, and 24Q1 profit increased sharply year on year; 2) the FCBGA packaging substrate business progressed steadily, forward-looking layout in the high-end PCB field; 3) the production cycle was further shortened, and there were breakthroughs in yield research and development. (Mainichi Keizai Shimbun)
Deep*Company*Xingsen Technology (002436): FCBGA packaging substrates continue to accelerate the upgrading of traditional PCB products
The company released its 2023 annual report and 2024 quarterly report. 23. The annual performance was under pressure, and 24Q1 profit increased sharply year on year. The company vigorously invested in the FCBGA packaging substrate project. Given the company's deep layout at the cutting edge of the industry, it is optimistic
SDIC Securities released a research report on April 25 stating that Xing Sen Technology (002436.SZ) was given a purchase rating, and the target price was 13.54 yuan. The main reasons for the rating include: 1) the industry is under short-term pressure, an
SDIC Securities released a research report on April 25 stating that Xing Sen Technology (002436.SZ) was given a purchase rating, and the target price was 13.54 yuan. The main reasons for the rating include: 1) the industry is under short-term pressure, and the company continues to break through high-end products; 2) FCBGA product strength continues to improve, and yield increases rapidly. (Mainichi Keizai Shimbun)
Minsheng Securities released a research report on April 25 stating that it gave Xingsen Technology (002436.SZ) a recommended rating. The main reasons for the rating include: 1) a smooth transition in revenue in 2023, with high investment in high-end packa
Minsheng Securities released a research report on April 25 stating that it gave Xingsen Technology (002436.SZ) a recommended rating. The main reasons for the rating include: 1) a smooth transition in revenue in 2023, with high investment in high-end packaging boards dragging down short-term performance; 2) focusing on the basic IC packaging business to create the second pole of the company's growth. (Mainichi Keizai Shimbun)
Xing Sen Technology (002436): Performance increased month-on-month, mass production of FCBGA carrier boards is imminent
Incident: The company released its 2023 annual report and 2024 first quarter report on April 24. In 2023, the company achieved revenue of 5.360 billion yuan, an increase of 0.11% over the previous year, and achieved net profit of 211 million yuan to mother, the same
Xing Sen Technology (002436): Adhere to the high-end product strategy and rapidly improve FCBGA yield
Incident: On April 24, the company released its 2023 annual report and 2024 quarterly report. The revenue for 2023 was 5.36 billion yuan, up 0.11% year on year, and net profit to mother was 211 million, up -59 million year on year.
Xing Sen Technology (002436): Being dragged down by the cost side for 23 years, the performance was pressured, and the company's FCBGA business was firmly optimistic
Overview of the event: 23 billion yuan in revenue of 5.36 billion yuan. YOY +0.11%, net profit to mother of 211 million yuan, yoy -59.82%, net profit of non-return to mother of 48 million yuan, yoy -87.92%; gross profit
Xing Sen Technology (002436): 2024Q1 performance will gradually resume, increase ABF carrier board construction to accelerate the localization process
Incidents. On April 24, the company released its 2023 Annual Report and 2024 Quarterly Report. In 2023, the company achieved operating income of 5.360 billion yuan, an increase of 0.11% over the previous year; achieved net profit of 211 million yuan to mother
Xing Sen Technology (002436.SZ): Net profit of 24.82 million yuan in the first quarter increased 230.82% year-on-year
Gelonghui, April 24 | Xing Sen Technology (002436.SZ) released its first quarter report. Operating revenue was 1,388 billion yuan, up 10.92% year on year, net profit of 24.82 million yuan, up 230.82% year on year, after deducting non-net profit of 239.266 million yuan, up 2500.78% year on year, with basic earnings of 0.01 yuan per share.
Xing Sen Technology (002436): Continued investment in pressure-bearing packaging substrates in the PCB business phase
Incident Overview On the evening of April 24, the company released its annual report for the year 23 and the quarterly report for '24: it achieved operating income of 5.360 billion yuan for the full year of '23, an increase of 0.11% over the previous year; net profit to mother was 211 million yuan, compared to the same period last year
Xing Sen Technology (002436.SZ): There is currently no cooperation with DJI
Gelonghui, April 1 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company currently has no cooperation with DJI. In the field of low-altitude flight, the company provides customers with products, and currently accounts for a relatively small share of revenue.
Xing Sen Technology (002436): FCBGA project investment increased under pressure due to forecast results in 2023
2023 forecast performance decreased by 54.34-60.05% year on year. The company disclosed the 2023 performance forecast. It is expected to achieve net profit of RMB 21-240 million in 2023, a year-on-year decline of 54.34% -60
Xing Sen Technology (002436.SZ): The application fields of CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc.
Gelonghui, March 27丨Xing Sen Technology (002436.SZ) said on the investor interactive platform that the application fields of the company's CSP packaging substrates cover memory chips, application processor chips, sensor chips, RF chips, etc., and are indirectly supplied to domestic mobile phone manufacturers in the fields of memory chips, RF chips, etc., but according to the 2022 annual report data, CSP packaging substrates account for only 12.88% of the company's overall revenue.
Xing Sen Technology (002436.SZ): The company's FCBGA packaging substrate can be used to package HBM storage
Gelonghui, March 20 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that HBM will not be packaged separately, but will be packaged together with the CPU/GPU through an FCBGA package substrate. The company's FCBGA packaging substrate can be used for packaging HBM storage, but it has not yet entered the leading overseas HBM industry chain.
Xing Sen Technology (002436.SZ) plans to join Guoneng Tongxin Venture Capital Fund Partnership
Xing Sen Technology (002436.SZ) issued an announcement. The company recently cooperated with Shenzhen Guoneng Jinhui Asset Management Co., Ltd.,...
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