By Product
Currency:CNY
2025/FY
2025/FY
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
2009/FY
2008/FY
2007/FY
Stock NameRevenueRatio
LED package and component products2.32B70.60%
贸易及应用类产品541.44M16.50%
Other business179.57M5.47%
Integrated circuit packaging test124.23M3.79%
Epitaxy and chip products119.45M3.64%
By Industry
Currency:CNY
2025/FY
2025/FY
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
Stock NameRevenueRatio
Electronic component manufacturing industry2.56B78.03%
Trade industry541.44M16.50%
Other business179.57M5.47%
By Country/Region
Currency:CNY
2025/FY
2025/FY
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
Stock NameRevenueRatio
Territory2.61B79.65%
Overseas667.79M20.35%
