By Product
Currency:CNY
2025/H1
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
2009/FY
2008/FY
2007/FY
Stock NameRevenueRatio
LED package and component products1.17B69.80%
贸易及应用类产品292.74M17.41%
Other business93.27M5.55%
Integrated circuit packaging test69.35M4.12%
Epitaxy and chip products52.35M3.11%
By Industry
Currency:CNY
2025/H1
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
Stock NameRevenueRatio
Electronic component manufacturing industry1.3B77.04%
Trade industry292.74M17.41%
Other business93.27M5.55%
By Country/Region
Currency:CNY
2025/H1
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
Stock NameRevenueRatio
Territory1.32B78.44%
Overseas362.55M21.56%
