About ASMPT Company

ASMPT has a footprint in more than 30 countries around the world, and the Group continues to use its advantages in international business networks and resources to drive the growth of its main business - post-processing equipment, materials and SMT solutions business segments. Established in 1975 in Hong Kong, the Group is the world's first equipment manufacturer to provide technology and solutions for all process steps of semiconductor packaging and electronic product production, from semiconductor packaging materials and back stages (chip integration, welding, packaging) to SMT processes. No other equipment supplier in the world has a similarly comprehensive product portfolio and extensive knowledge and experience of assembly and SMT procedures. The Semiconductor Solutions segment manufactures and provides semiconductor assembly and packaging equipment for the microelectronics, semiconductors, optoelectronics, and optoelectronics markets. It provides diversified products such as solid crystal systems, wire welding systems, epoxy glue systems, cutting and forming systems, and a full range of production line equipment. The materials business produces and provides semiconductor packaging materials, which consist of a lead frame and a molded interconnect substrate. The SMT Solutions business is responsible for developing and distributing first-class DEK printers, as well as first-class SIPACESMT mounting solutions for the SMT, semiconductor and solar markets. ASMPT is headquartered in Singapore and has been listed on the Hong Kong Stock Exchange since 1989.