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Express News | NTT Data Group: NVIDIA bubble may burst within three years as computing power demand could plummet by a million-fold
In-Depth Research Report on Montage Technology (688008): Global Leader in Memory Interconnect Chips, Forging a Second Growth Engine with Data Processing Chips
A global leader in memory interface chips, building a long-term growth curve through multi-sector synergy. Montage Technology was established in 2004 and listed on the STAR Market of the Shanghai Stock Exchange in 2019 as one of the first batches of companies. In February 2026, it [listed on the Hong Kong Stock Exchange].
Express News | Xiaomi's Lu Weibing: Memory price hikes may slow in the second half of the year; Xiaomi to launch flagship smartphones and the Pengcheng series.
Express News | Data from the Hong Kong Exchange shows that JPMorgan's long position in Montage Technology's H-shares decreased from 11.57% to 9.47% on August 13, with an average selling price of HKD 292.8153 per share.
[HK Stocks] Hang Seng Index closed 17 points lower for the day; Alibaba rose over 3%, supporting the broader market, while Zhipu briefly breached the HK$1,000 mark.
Overnight (on the 17th), the three major U.S. stock indices closed lower by 0.3% to 0.5%, as renewed tensions in the Middle East pushed international oil prices up by more than 2%. This morning (on the 18th), the Hang Seng Index opened 84 points lower, with losses widening to over 200 points at one stage. However, Hong Kong stocks reversed course in the afternoon, with the Hang Seng Index closing slightly higher by 17 points, or 0.07%, at 25,471 points. Total market turnover for the day amounted to HK$255.541 billion. The Hang Seng China Enterprises Index closed up 13 points, or 0.16%, at 8,453 points, while the Hang Seng Tech Index fell 42 points, or 0.9%, to close at 4,739 points. Alibaba-W (09988.HK) supported the broader market.
UBS Group surveys China's AI industry chain: Large models are accelerating iteration, and capital is beginning to flow into semiconductors.
Demand for domestic computing power continues to rise, with industry focus shifting from single-model capabilities to chips, interconnects, advanced packaging, and complete system integration.