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Zhitong A Share Sale Restriction and Release List | March 29
According to the Zhitong Finance App, the ban on restricted shares of 12 listed companies was lifted on March 29, with a total market value of about 10.306 billion yuan. Today's specific sales restrictions and unbanned shares are as follows: Stock abbreviation, stock code, restricted stock type, number of unbanned shares*ST Jinglan 000711, other 159.453 million COSCO Haike 002401 share incentives, 2.1208 million ordinary people, 60,3883 share incentives to limit sales and circulation 66.84 million, Sdic 300806 shares are restricted in sale and circulation before issuance, 8.615 million, future electrical appliances 301,386 shares are restricted in sale and circulation is 7.921 million, Haitong Development6
Darbond Technology Co., Ltd's (SHSE:688035) Top Holders Are Insiders and They Are Likely Disappointed by the Recent 17% Drop
Key Insights Insiders appear to have a vested interest in Darbond Technology's growth, as seen by their sizeable ownership The top 5 shareholders own 51% of the company 10% of Darbond Technology
Debon Technology (688035.SH): 6.68 million restricted shares will be listed and distributed from March 29
Debon Technology (688035.SH) issued an announcement. The number of shares in circulation that the company has lifted sales restrictions and applied for listing is 6...
Debon Technology (688035.SH): Liquid plastic encapsulant LMC has not been laid out
Gelonghui, March 21丨Debon Technology (688035.SH) said on the investor interactive platform that the company has not deployed a liquid plastic packaging LMC.
Debon Technology (688035.SH): The company's products can be used in Huawei's consumer electronics products
Gelonghui, March 21丨Debon Technology (688035.SH) said on the investor interactive platform that the company's products can be used in Huawei's consumer electronics products, and that Huawei is one of our important customers in the field of smart terminals.
Debon Technology (688035.SH): Existing models of chip-level underfill adhesives have been verified by some domestic customers
GLONGHUI March 21丨Debon Technology (688035.SH) said on the investor interactive platform that currently the company's products have not been used in HBM. HBM is a DRAM memory chip based on a 3D stacking process. It is stacked with multiple layers of DRAM, and each layer of DRAM is welded together through a bump. After welding, there will be a gap between the DRAM and DRAM. The bump is very fragile and needs to be protected with bottom filler to balance the stress. Existing models of the company's chip-grade underfill adhesive (Underfill) have been verified by some domestic customers. Will it be possible in the future
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