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Express News | The concept of advanced packaging surged amid fluctuations, with JCET Group hitting the daily price limit and reaching a new all-time high.
Earnings Meeting of STAR Market Semiconductor Manufacturing and Testing Companies: Q1 at Full Capacity, Seizing AI Growth Opportunities
①Today, the STAR Market's '15th Five-Year Plan' themed collective earnings presentation on semiconductor manufacturing and packaging testing was held, with participating companies including Fangbang Co., Ltd., Liyang Chip, Yandong Microelectronics, Qipai Technology, and Jinghe Integration, among others; ②The semiconductor industry has now entered a structural recovery and upward channel, with the high prosperity of the AI industry serving as the core driver, boosting demand in advanced manufacturing, advanced packaging, and chip testing segments.
Yongshi Electronics (688362): Gross margin steadily increases, focusing on overseas leading clients and new AI-related customers.
The company focuses on high-value customer segments, with an emphasis on overseas leading customers and new AI-related clients. Since the launch of Phase II projects, the utilization rate of mature packaging capacity has remained high, while the utilization rate of wafer-level packaging capacity continues to increase. Revenue and profitability have shown sustained improvement.
Yongshi Electronics (688362): Increased investment in advanced packaging, with a significant rise in revenue contribution from overseas customers.
Event: The company achieved operating revenue of 4.398 billion yuan in 2025, representing a year-on-year increase of 21.87%; net profit attributable to shareholders was 82 million yuan, up 23.22% year-on-year, while non-recurring net profit posted a loss of 47 million yuan. Additionally, the company...
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