After years of development and accumulation, the company has become a leading player in China's LED packaging and capacitor aging-test smart manufacturing equipment sectors. Leveraging its robust R&D capabilities and continuous technological innovation, it has also successfully expanded into the semiconductor packaging equipment and lithium-battery equipment markets. The company primarily engages in the R&D, production, and sales of smart manufacturing equipment for industries such as semiconductors, next-generation displays, capacitors, and lithium batteries, providing customers with advanced, reliable equipment and comprehensive solutions to enable smart manufacturing. Its key products include semiconductor die bonders (HAD812i series), high-precision semiconductor die bonders (HAD8212advanced), clip-based assembly line wire bonding machines (HAD812DDCO), dual-arm force-controlled die bonders (HAD816 series), wafer-type eutectic bonders (HAD810RP-PLUS), reel-fed arm-type eutectic bonders (HAD810-RJ), fully automatic multi-axis lead wire bonding machines (K940-P), coarse aluminum wire pressure bonders (K580), fully automatic planar wire bonding machines (KAW916), turret-type semiconductor test and sorting machines (XYC2220S and XYC2224S series), optical coating equipment, six-head high-speed planar die bonders (HAD8606 series), fully automatic intelligent horn-type aging test and sorting machines (HATC series), fully automatic supercapacitor aging test and sorting machines (YCC series), and fully automatic cylindrical lithium-battery cell formation and winding integrated machines (DC1860Y series), among others.
91440300790475587F
The issuer is primarily engaged in the R&D, manufacturing, and sales of intelligent manufacturing equipment for industries such as LEDs, capacitors, semiconductors, and lithium batteries, providing customers with advanced and reliable equipment and solutions to enable smart manufacturing.