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成功领取价值超 5000港元/年的高级行情
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多维分析
公司估值 资金追踪 卖空分析
01347 华虹半导体
28.400
+0.300+1.07%
显示同比
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隐藏空行
(Q3)2022/03/31(FY)2021/12/31(Q9)2021/09/30(Q6)2021/06/30
Per Share IndicaTor
Operating Cash Flow Per Share
223.31% 1.1761 93.29% 3.1072 68.91% 1.8657 67.39% 0.9551
Cash Flow Per Share
102.56% 0.4873 66.45% 4.0156 132.82% 3.1016 -80.11% 0.27
Operating Income Per Share
96.15% 3.5758 70.2% 9.7731 61.93% 6.5996 51.46% 3.8869
Net Asset Per Share
17.13% 17.8447 13.89% 17.2021 13.58% 16.0959 16.32% 15.7427
Basic Earning Per Share
218.13% 0.6184 162.57% 1.5674 -- -- 97.01% 0.4581
Diluted  Earning Per Share
214.11% 0.6105 162.05% 1.544 -- -- 100.35% 0.4503
Profitability
Gross Profit Ratio
13.69% 26.911% 13.38% 27.693% 6.48% 25.406% 2.56% 24.246%
Operating Profit Ratio
162.1% 15.704% 791.6% 18.567% 3022.31% 12.042% 714% 10.523%
Net Profit Ratio
150.14% 17.170% 308.68% 14.163% 1033.7% 8.501% 854.09% 8.926%
Earning Before Tax Ratio
146.87% 16.016% 279.09% 18.171% 661.98% 11.688% 6822.84% 10.974%
ROE
170.87% 3.533% 133.63% 9.713% 103.55% 4.915% 76.91% 2.989%
ROA
130.22% 1.648% 100.64% 4.867% 68.25% 2.455% 52.58% 1.615%
Yield Quality
Operating Profit To Total Profits
6.17% 98.052% 135.2% 102.180% 483.51% 103.027% -- 95.890%
Tax To Total Profits
24.18% 7.208% 20.38% -22.054% 46.65% -27.267% -- -18.667%
Operating Cash To Total Revenue
64.83% 32.892% 13.57% 31.793% 4.31% 28.271% 10.52% 24.573%
Capital Structure
Debt Assets Ratio
41.44% 40.083% 52.7% 40.592% 92.92% 40.666% 109.64% 30.844%
Equity Multipler
15.8% 2.1284 19.58% 2.1607 28.65% 2.1849 19.55% 1.893
Debt Equity Ratio
69.17% 66.896% 88.71% 68.327% 156.6% 68.537% 158.54% 44.600%
Current Assets To tatal Assets
25.92% 40.762% 25.25% 38.555% 32.3% 36.918% -1.51% 32.352%
Non Current Assets To Total Assets
-12.41% 59.238% -11.23% 61.445% -12.5% 63.082% 0.74% 67.648%
Current Liabilities To tatal Liabilities
-15.4% 43.760% -21.63% 42.915% -47.34% 49.895% -37.1% 58.224%
Non Current Liabilities To Total Liabilities
16.51% 56.240% 26.18% 57.085% 855.09% 50.105% 461.37% 41.776%
Solvency
Current Ratio
5.23% 2.3239 4.67% 2.2132 30.24% 1.8195 -25.32% 1.8015
Quick Ratio
16.81% 1.9162 2.17% 1.8125 30.29% 1.4875 -31.46% 1.4045
Operating Profit To Current Liabilities
216.77% 0.0843 831.06% 0.2802 3287.66% 0.1114 607.12% 0.0764
Operrating Cash Flow To Current Liabilities
99.21% 0.1765 18.59% 0.4799 13.8% 0.2615 -8.72% 0.1785
Share Equity Without Minority Interest To Total Liabilities
-38.95% 1.1722 -45.24% 1.1401 -59.71% 1.1255 -60.1% 1.7127
Operating Cash Flow To Total Liabilities
68.52% 0.0773 -7.06% 0.2059 -40.08% 0.1305 -42.58% 0.1039
Operating Profit To Total Liabilities
167.97% 0.0369 629.65% 0.1203 1778.88% 0.0556 418.99% 0.0445
Operating Capacity
Current Assets Turnover(T)
14.83% 0.2399 30.27% 0.8607 19.09% 0.6178 34.88% 0.4312
Fixed Assets Turnover(T)
58.44% 0.1931 23.2% 0.5811 12.42% 0.399 -2.19% 0.2496
Total Assets Turnover(T)
44.22% 0.0952 29.45% 0.3036 18.83% 0.2115 14.68% 0.1363
Growth Ability
Operating Revenue GR 3Y
285.37% 168.607% 314.68% 74.519% -- -- 302.9% 46.371%
Gross Income GR 3Y
247.45% 177.011% 234.61% 80.550% -- -- 222.75% 53.927%
Operating Profit GR 3Y
297.35% 108.191% 146.58% 40.980% -- -- 73.61% -28.916%
EBT GR 3Y
320.64% 112.327% 145.51% 33.452% -- -- 71.5% -28.766%
Net Profit GR 3Y
344.05% 118.291% 130.92% 23.887% -- -- 64.68% -33.262%
Net Profit Attributable To The Parent Company GR 3Y
734.71% 116.263% 231.21% 42.125% -- -- 75.03% -11.147%
Total Assets GR 3Y
-17.24% 78.857% -14.75% 100.552% 20.13% 120.975% -2.16% 84.916%
Share Equity Without Minority Interest GR 3Y
-20.51% 31.707% -31.99% 32.567% 26.24% 56.524% 16.06% 51.272%
Equity GR 3Y
-68.68% 20.912% -62.97% 35.619% -42.3% 54.264% -47.53% 49.697%
Total Liabilities GR 3Y
117.34% 530.628% 166.03% 570.148% 282.79% 498.796% 469.89% 291.365%
Basic Earning Per Share GR 3Y
396.5% 112.907% 137.45% 17.021% -- -- 52.93% -27.041%
Net Assets Per Share GR 3Y
153.14% 30.011% 69.01% 30.810% 62.16% 25.317% 38.21% 21.093%
Other Indicators
Currency Unit
港元港元港元港元

Q6、Q9、FY为累计季报:Q6 为中期报告;Q9 为第三季报;FY为年报。

环比数据来源于季报,环比 = (本期 - 上期)/上期 * 100%

公司概况 更多
华虹半导体有限公司是一家从事半导体晶片的生产和销售的投资控股公司。该公司从事生产200毫米和300毫米晶圆。其产品应用于通用型微控制单元(MCU)、Type-C接口控制芯片、摄像头防抖控制芯片、触控芯片和智能电表控制芯片。该产品还服务于物联网(IoT),新能源汽车,人工智能和其他市场。该公司通过其子公司开展业务。
董事长: 张素心
所属市场: 香港主板
上市日期: 2014/10/15
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