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Kingsemi Co., Ltd. (688037.SH): The controlling shareholder has changed to NAURA Technology Group.
On June 24, 2023, Kingsemi Co., Ltd. (688037.SH) announced that on June 24, 2025, the company received the "Securities Transfer Registration Confirmation" issued by China Securities Depository and Clearing Corporation Limited, confirming that the transfer of shares of the company through the public solicitation method by Zhongke Tiansheng has completed the share transfer registration process. The share transfer date is June 23, 2025, with a total of 16,899,750 shares transferred. As of June 23, 2025, after the completion of the share transfer between Zhongke Tiansheng and Advanced Manufacturing, NAURA Technology Group holds 35,964,665 shares of the company.
Express News | The Concept of the lithography machine has surged due to strong new material stocks reaching a 20% limit up.
Express News | Chip stocks have fluctuated and rebounded, with Juchip Technology rising over 10%.
Express News | The State Administration for Market Regulation released the list of cases of unconditional approval for operator concentration from May 26 to June 1.
Soochow Securities: Strongly recommend equipment going overseas with strong certainty and low market share for oil service equipment.
Looking to the future, the Middle East oil service market is on the scale of hundreds of billions of dollars, with the oil service equipment market being at least in the tens of billions of dollars. Chinese oil service equipment companies are currently in the initial stage in the Middle East, with a relatively low market share, offering high growth potential and being less affected by industry β (such as oil prices).
NAURA Technology Group (002371.SZ): offers various core equipment in the fields of HBM chip manufacturing and advanced packaging, including etching, thin film deposition, thermal processing, wet processing, and ion implantation.
On June 5, Gelonghui reported that NAURA Technology Group (002371.SZ) stated on the interactive platform that the company can provide various core equipment in the fields of HBM chip manufacturing and advanced packaging, including etching, thin film deposition, heat treatment, wet processing, and ion implantation.
