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成功领取价值超 5000港元/年的高级行情
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多维分析
公司估值 资金追踪 卖空分析
01347 华虹半导体
26.200
+0.050+0.19%
显示同比
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隐藏空行
(Q3)2022/03/31(FY)2021/12/31(Q9)2021/09/30(Q6)2021/06/30
Cash flow from operating activities
Earning before tax
381.56% 9,523.8万 543.1% 2.96亿 1133.2% 1.29亿 10320.03% 7,143.8万
Profit adjustment
Interest (income) - adjustment
-- -- -25.5% -1,343.7万 -16.14% -658.5万 -16.14% -658.5万
Attributable subsidiary (profit) loss
-- -- 74.04% -676.5万 67.34% -432.9万 59.55% -293.6万
Impairment and provisions:
-- 0 -39.51% 408.3万 106.28% 49.3万 106.28% 49.3万
-Impairment of property, plant and equipment (reversal)
-- -- 251.23% 399万 -- 146.2万 -- 146.2万
-Impairmen of inventory (reversal)
-- -- -103.21% -18万 -505.44% -96.9万 -505.44% -96.9万
-Impairment of trade receivables (reversal)
-- -- -- 27.3万 -- -- -- --
Revaluation surplus:
-- 0 7.58% -18.3万 -- 0 -- 0
-Fair value of investment properties (increase)
-- -- 7.58% -18.3万 -- -- -- --
Asset sale loss (gain):
-- 0 -- 0 -- 8,000 -- 8,000
-Loss (gain) on sale of property, machinery and equipment
-- -- -- -- -- 8,000 -- 8,000
Depreciation and amortization:
-- 0 54.11% 3.18亿 58.61% 2.38亿 60.89% 1.5亿
-Depreciation
-- -- 53.99% 3.08亿 57.06% 2.32亿 58.41% 1.45亿
-Amortization of intangible assets
-- -- 58.03% 1,009.5万 176.46% 541.3万 176.46% 541.3万
Financial expense
-- -- 345.62% 1,322.6万 717.8% 505.4万 717.8% 505.4万
Special items
-- -- -89.45% 29.6万 -53.26% 189万 -53.26% 189万
Operating profit before the change of operating capital
381.56% 9,523.8万 168.24% 6.12亿 157.11% 3.63亿 176.35% 2.19亿
Change of operating capital
Inventory (increase) decrease
-- -- -127.31% -2.07亿 -269.21% -1.29亿 -269.21% -1.29亿
Developing property (increase)decrease
-- -- -- -1,085.8万 -- -- -- --
Accounts receivable (increase)decrease
-- -- -31.05% 7,526.6万 -58.61% 1,123.5万 -58.61% 1,123.5万
Accounts payable increase (decrease)
-- -- 24.34% 5,825.9万 73.13% 1,610.08万 73.13% 1,610.08万
prepayments (increase)decrease
-- -- 34.76% -1,024.8万 -- -- -- --
Cash  from business operations
381.56% 9,523.8万 84.29% 5.39亿 59.69% 3.32亿 52.16% 1.8亿
Other taxs
-- -- 12.32% -2,044.8万 12.53% -2,039.9万 12.53% -2,039.9万
Special items of business
144.44% 1亿 43.62% 2,162.4万 7.74% 7,006.72万 49.79% 5,627万
Adjustment items of business operations
-- -- -- -- -- -- -- 606.92万
Net cash from operations
221.53% 1.96亿 92.66% 5.18亿 68.82% 3.12亿 68.01% 1.6亿
Cash flow from investment activities
Interest received - investment
-- -- -33.64% 589.9万 -47.06% 308.9万 -47.06% 308.9万
Sale of fixed assets
-- -- -- 5.4万 -- 4万 -- 4万
Purchase of fixed assets
25.86% -1.24亿 13.64% -9.39亿 28.83% -5.57亿 19.74% -3.04亿
Acquisition of subsidiaries
-- -- -- -- -- -148.4万 -- -148.4万
Cash on investment
-- -- 98.14% -1,369.5万 99.2% -592.1万 -- --
Other items in the investment business
440.29% 709.4万 4.32% 8,359.4万 -105.74% -506.4万 -- --
Net cash from investment operations
30.17% -1.17亿 -112.75% -8.63亿 -210.16% -5.66亿 -327.49% -3.02亿
Net cash before financing
173.67% 7,860.3万 -152.35% -3.45亿 -12074.95% -2.54亿 -162.39% -1.42亿
Cash flow from financing activities
New borrowing
-66.89% 4,741.3万 19.89% 10.71亿 262.64% 7.96亿 -- 1.91亿
Refund
-- -4,320.8万 86.5% -4,786万 -926.95% -2,176.1万 -9.58% -232.2万
Issuing shares
-80.73% 125.2万 -9.27% 741.9万 -7.47% 700.9万 73.42% 664.9万
Interest paid - financing
-673.91% -53.4万 -311.83% -1,172.9万 -562.63% -459.2万 -601.62% -433.6万
Other items of the financing business
8.31% -248.4万 -8.86% -399.5万 -8.52% -398.7万 -22.96% -327.7万
Net cash from financing operations
-98.34% 243.9万 87.75% 10.15亿 250.27% 7.72亿 12058.67% 1.88亿
Effect of rate
348.31% 375.2万 -59.41% 1,730.2万 -80.28% 345.6万 270.05% 651.3万
Net Cash
101.44% 8,104.2万 65.91% 6.7亿 132.7% 5.18亿 -80.03% 4,522.3万
Begining period cash
74.49% 16.1亿 93.75% 9.23亿 61.44% 18.97亿 93.75% 9.23亿
Cash at the end
76.28% 16.95亿 74.49% 16.1亿 70.89% 24.19亿 39.43% 9.75亿
Cash balance analysis
Cash and cash equivalent balance
-- 0 -- 0 -- 0 -- 0
Currency Unit
美元美元美元美元
Accounting Standards
香港会计准则香港会计准则香港会计准则香港会计准则
Audit Opinions
--无保留意见----
Auditor
--安永会计师事务所----

Q6、Q9、FY为累计季报:Q6 为中期报告;Q9 为第三季报;FY为年报。

环比数据来源于季报,环比 = (本期 - 上期)/上期 * 100%

公司概况 更多
华虹半导体有限公司是一家从事半导体晶片的生产和销售的投资控股公司。该公司从事生产200毫米和300毫米晶圆。其产品应用于通用型微控制单元(MCU)、Type-C接口控制芯片、摄像头防抖控制芯片、触控芯片和智能电表控制芯片。该产品还服务于物联网(IoT),新能源汽车,人工智能和其他市场。该公司通过其子公司开展业务。
董事长: 张素心
所属市场: 香港主板
上市日期: 2014/10/15
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