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Not Just CPUs! Citi Upgrades AMD to 'Buy,' Hailing the GPU Business as a Second Growth Engine
“We now believe AMD is becoming a truly credible second option in the GPU market and is poised to capture the vast majority of Meta’s market share,” Citi wrote.
The Chip-stock Rally Is Back in Full Force - Thanks to Two Big Geopolitical Developments
Advanced Micro Devices Acquires Predictive Memory Technology Developer
Anthropic’s 'Premium AI Plan' Backfires? Users Sue Over Reduced Claude Usage Limits: $200 Monthly Fee Not Enough
Anthropic is being sued by users over its high-priced Claude Max 5x/20x subscription tiers, with plaintiffs alleging a mismatch between advertised and actual usage limits. They claim that heavy usage frequently hits weekly caps, resulting in substantially lower availability than promised in marketing materials. The case has sparked debate over transparency and pricing mechanisms in AI subscriptions, reflecting broader commercial pressures stemming from computational resource constraints across the industry.
SpaceX, OpenAI, and Anthropic line up to ring the bell: Who will ultimately foot the bill for the largest IPO wave in history?
Analysts at GLJ Research noted that U.S. IPO fundraising in 2026 could reach $200 billion—exceeding the combined total from the internet bubble years of 1999 and 2000, and nearly double the amount raised during the speculative peak of 2021. Historically, record-breaking issuance volumes have not signaled market prosperity; rather, they have served as a warning that a market top is approaching, as such activity drains liquidity from the market.
Alleviation of the CoWoS shortage does not equate to bottleneck resolution: TPU offloading and Taiwan Semiconductor's CoPoS strategy signal repricing of AI computing capacity
The narrowing CoWoS capacity gap merely reflects a 'temporary easing of the current AI packaging backlog,' not the 'end of bottlenecks in AI computing processes and advanced nodes.' Google's diversification to Samsung, TSMC's price increase for its 3-nanometer process, and CoPoS mass production plans collectively indicate that bottlenecks are shifting from CoWoS capacity toward advanced process technology, ultra-large packaging, glass-core substrates, through-glass vias (TGV), and system-level yield economics.