By Product
Currency:CNY
2025/H1
Stock NameRevenueRatio
系统级封装产品827.52M41.16%
扁平无引脚封装产品759.67M37.79%
高密度细间距凸点倒装产品294.96M14.67%
晶圆级封测产品85.28M4.24%
Other business28.25M1.41%
Other products10.41M0.52%
Total special adjustments4.19M0.21%
View all
By Industry
Currency:CNY
2024/FY
Stock NameRevenueRatio
Integrated circuit packaging test3.54B97.96%
Other business73.47M2.04%
By Country/Region
Currency:CNY
2025/H1
Stock NameRevenueRatio
Territory1.5B74.47%
Overseas509.12M25.33%
Total special adjustments4.19M0.21%
